福越电子 FUYUE ELECTRONICS

Capabilities

Manufacturing Capabilities

Full-process capability from paste printing to functional testing — key parameters and equipment brands, all public.

Capacity overview

SMT

70,950

Single-line peak 70,950 CPH

DIP

2,000

2,000 pcs/hr per wave line

Test

1,000

1,000 pcs/hr ICT/FCT

Line overview — SMT line overview

Four core capabilities

Inside an SMT mounter: placement head and feeder bank

SMT Assembly

3 YAMAHA lines, precision placement down to 01005.

DIP Assembly

DIP Assembly

Dual wave-solder lines, hand soldering and box build.

Test & QC

Test & QC

7 inspection stages, full-chain test coverage.

Equipment List

Equipment List

Brands and models published — verify on site.

Equipment archive

SPI

Paste inspector 2.5D

Paste inspector 2.5D

AOI

Auto optical JTA-600

Auto optical JTA-600

X-RAY

BGA solder imaging

BGA solder imaging

ICT/FCT

In-circuit & functional

In-circuit & functional

CMM

2D measuring

2D measuring

LCR

LCR meter

LCR meter

FAI

First article tester

First article tester

CUT

Auto depaneling machine

Auto depaneling machine

Process	Equipment / model	Qty
Paste printing	Automatic printer Classic 1008	3
High-speed placement	YAMAHA YSM20R module	2
Flexible placement	YAMAHA YSM10 + NTS platform	3
Reflow soldering	Reflow oven AS-800 / MS-800	2
Paste inspection	2.5D SPI paste inspector	1
Optical inspection	AOI JTA-600	2
Solder imaging	X-Ray inspection system	1
Electrical / functional	ICT / FCT fixtures	4
Metrology	2D measuring / LCR meter	2
First article	First article tester	1
Wave soldering	Dual wave-solder line	2

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